It makes perfect sense. Components drawing power produce heat, which
causes a temperature rise above ambient. Put simply, if a chip that
fails at a case temperature of 50C and you have a 10C rise, it'll fail
at 40C. If you have a 20C rise, it'll fail at 30C.
PS, the efficiency of heatsinks is measured in degC/W - how many degrees
celcius the temperature rises for each watt of power dissipated. Double
the dissipated power, double the temperature rise.
-- Russell King (email@example.com) The developer of ARM Linux http://www.arm.linux.org.uk/personal/aboutme.html
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