Re: SMP/cc Cluster description [was Linux/Pro]

Alan Cox (alan@lxorguk.ukuu.org.uk)
Thu, 6 Dec 2001 00:34:23 +0000 (GMT)

> So either way, you wind up with SMP on one die. (You can't make chips TOO
> much smaller because it becomes less economical to cut the wafer up that
> small. Harvesting and connecting the chips at finer granularity increases

Except for VIA (where they cant really make them much smaller) the
mainstream x86 dies are _gigantic_

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